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1.0mmt Soft Compressible Gap Pad Thermal Conductivity For Memory Modules

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1.0mmt Soft Compressible Gap Pad Thermal Conductivity For Memory Modules

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1.0mmt Soft Compressible Gap Pad Thermal Conductivity For Memory Modules

1.0mmT Soft and compressible for Low Stress Applications Silicone Pads for Memory Modules The TIF140-30-02US use a special process, with silicone as the base material, adding thermal conductive ...

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1.0mmt gap pad thermal conductivity

memory modules gap pad thermal conductivity

memory modules thermal gap filler material

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