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PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microproce

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PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microproce

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PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microproce

Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors ...

Product Tags:

adhesive foam tape

acrylic adhesive tape

heat dissipation fins thermal adhesive tape

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