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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink

0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink

0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink

The TIA™810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding ...

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