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Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk

    Buy cheap Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk from wholesalers
     
    Buy cheap Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk from wholesalers
    • Buy cheap Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk from wholesalers
    • Buy cheap Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk from wholesalers

    Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk

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    Brand Name : ZIITEK
    Model Number : TIF120-50-11US
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 100000pcs/day
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    Electrically Isolating Thermal Gap Filler Pad For Memory Modules 5.0 W/Mk

    Electrically isolating UL recognized TIF120-50-11US thermal pad for Memory Modules ,5.0 W/mK


    The TIF120-50-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


    TIF100-50-11US-Datasheet-REV02.pdf


    Features

    > Good thermal conductive: 5.0 W/mK

    >Thickness:0.5mmT

    >hardness:20 shore00

    >Colour: Gray

    >Good thermal conductive

    >Moldability for complex parts

    >Soft and compressible for low stress applications


    Applications

    >mainboard/mother board

    >notebook

    >power supply

    >Heat pipe thermal solutions

    >Memory Modules

    >Mass storage devices


    Typical Properties of TIF120-50-11US Series
    Color
    gray
    Visual
    Composite Thickness
    Thermal Impedance@10psi
    (℃-in²/W)
    Construction &
    Compostion
    Ceramic filled silicone elastomer
    ***
    10mils / 0.254 mm
    0.16
    20mils / 0.508 mm
    0.20

    Specific gravity

    2.9g/cc
    ASTM D297
    30mils / 0.762 mm
    0.31
    40mils / 1.016 mm
    0.36
    Thickness
    0.5mmT
    ***
    50mils / 1.270 mm
    0.42
    60mils / 1.524 mm
    0.48
    Hardness
    20 Shore 00
    ASTM 2240
    70mils / 1.778 mm
    0.53
    80mils / 2.032 mm
    0.63
    Outgassing(TML)
    0.4%
    ASTM E595
    90mils / 2.286 mm
    0.73
    100mils / 2.540 mm
    0.81
    Continuos Use Temp
    -40 to 160℃
    ***
    110mils / 2.794 mm
    0.86
    120mils / 3.048 mm
    0.93
    Dielectric Breakdown Voltage
    >5500 VAC
    ASTM D149
    130mils / 3.302mm
    1.00
    140mils /3.556 mm
    1.08
    Dielectric Constant
    4.2 MHz
    ASTM D150
    150mils / 3.810 mm
    1.13
    160mils / 4.064 mm
    1.20
    Volume Resistivity
    1.0X1012
    Ohm-cm
    ASTM D257
    170mils / 4.318 mm
    1.24
    180mils / 4.572 mm
    1.32
    Fire rating
    94 V0
    equivalent
    UL
    190mils / 4.826 mm
    1.41
    200mils / 5.080 mm
    1.52
    Thermal conductivity
    5.0 W/m-K
    ASTM D5470
    Visua l/ ASTM D751
    ASTM D5470

    Company Profile


    With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


    Peressure Sensitive Adhesive:

    Request adhesive on one side with "A1" suffix.

    Request adhesive on double side with "A2" suffix.


    Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.



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