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Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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Cc For RDRAM Memory Modules

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Brand Name :	ZIITEK
Model Number :	TIF5200-40-11US
Certification :	UL and RoHs
Price :	negotiation
Supply Ability :	10000/day
Delivery Time :	3-5work days

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Product Details
Company Profile

Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules

China company supplied thermal gap filler 4w/MK Specific Gravity 3.1 g/cc for RDRAM memory modules

The TIF5200-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

TIF500-40-11US Datasheet-REV02.pdf

Features:
> Good thermal conductive: 4.0 W/mK
>Thickness:5.0mmT
>hardnesses :20 (Shore 00)

>UL recognized

>Fiberglass reinforced for puncture, shear and tear resistance

>Easy release construction

>Electrically isolating

>High durability

Applications:

>RDRAM memory modules

>Micro heat pipe thermal solutions

>Automotive engine control units

>CD-Rom, DVD-Rom cooling

>LED Power Supply

>LED Controller

>LED Ceilinglamp

Typical Properties of TIF5200-40-11US Series
Color	gray	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.55
			20mils / 0.508 mm	0.82
Specific Gravity	3.1 g/cc	ASTM D297	30mils / 0.762 mm	1.01
			40mils / 1.016 mm	1.11
Thickness	5.0mmT	***	50mils / 1.270 mm	1.27
			60mils / 1.524 mm	1.45
Hardness	20 (Shore 00)	ASTM 2240	70mils / 1.778 mm	1.61
			80mils / 2.032 mm	1.77
Tensile Strength	40 psi	ASTM D412	90mils / 2.286 mm	1.91
			100mils / 2.540 mm	2.05
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	2.16
			120mils / 3.048 mm	2.29
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	2.44
			140mils / 3.556 mm	2.56
Dielectric Constant	4.0 MHz	ASTM D150	150mils / 3.810 mm	2.67
			160mils / 4.064 mm	2.77
Volume Resistivity	6.0X10¹³ Ohm-meter	ASTM D257	170mils / 4.318 mm	2.89
			180mils / 4.572 mm	2.98
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	3.05
			200mils / 5.080 mm	3.14
Thermal conductivity	4.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

FAQ:

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

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