Home > Thermal Gap Pad >

4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics

Product Categories

Phase Changing Materials [41]
Thermal Conductive Pad [197]
Thermal Gap Filler [220]
Thermal Conductive Grease [28]
Thermal Insulation Materials [48]
Thermal Graphite Sheet [53]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [24]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [12]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics

Ask Lasest Price
Brand Name :	ZIITEK
Model Number :	TIF5100-40-11US
Certification :	UL and RoHs
Price :	negotiation
Supply Ability :	10000/day
Delivery Time :	3-5work days

Add to Cart

Product Details
Company Profile

4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics

China company supplied 4w heat sink pad 20 shore00 3.1 g/cc for Handheld portable electronics

The TIF5100-40-11US is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF5100-40-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. TIF5100-40-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request

TIF500-40-11US Datasheet-REV02.pdf

Features:
> Good thermal conductive: 4.0 W/mK
>Thickness:2.5mmT
>hardnesses :20 (Shore 00)

>Naturally tacky needing no further adhesive coating

>Moldability for complex parts

>Outstanding thermal performance

>High durability

Applications:

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>notebook

>power supply

>Heat pipe thermal solutions

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling

>LED Power Supply

Typical Properties of TIF5100-40-11US Series
Color	gray	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.55
			20mils / 0.508 mm	0.82
Specific Gravity	3.1 g/cc	ASTM D297	30mils / 0.762 mm	1.01
			40mils / 1.016 mm	1.11
Thickness	2.5mmT	***	50mils / 1.270 mm	1.27
			60mils / 1.524 mm	1.45
Hardness	20 (Shore 00)	ASTM 2240	70mils / 1.778 mm	1.61
			80mils / 2.032 mm	1.77
Tensile Strength	40 psi	ASTM D412	90mils / 2.286 mm	1.91
			100mils / 2.540 mm	2.05
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	2.16
			120mils / 3.048 mm	2.29
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	2.44
			140mils / 3.556 mm	2.56
Dielectric Constant	4.0 MHz	ASTM D150	150mils / 3.810 mm	2.67
			160mils / 4.064 mm	2.77
Volume Resistivity	6.0X10¹³ Ohm-meter	ASTM D257	170mils / 4.318 mm	2.89
			180mils / 4.572 mm	2.98
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	3.05
			200mils / 5.080 mm	3.14
Thermal conductivity	4.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

FAQ:

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Product Tags:


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!