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1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules

    Buy cheap 1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules from wholesalers
     
    Buy cheap 1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules from wholesalers
    • Buy cheap 1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules from wholesalers
    • Buy cheap 1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules from wholesalers
    • Buy cheap 1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules from wholesalers

    1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF5120-18-11US
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules

    1.8W/mK 20 shore00 Moldability for complex parts heat sink pad ,3.0mmT for Memory Modules

    The TIF5120-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


    TIF500-18-11US Datasheet-REV02.pdf


    Company Profile

    Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

    Our vast experience allows us to assist our customers best in thermal engineering field.

    We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


    Features:

    >Thickness:3.0mmT
    > Good thermal conductive: 1.8W/mK

    >UL recognized

    >Fiberglass reinforced for puncture, shear and tear resistance

    >Easy release construction

    >Soft and compressible for low stress applications

    >Naturally tacky needing no further adhesive coating

    >Available in varies thicknesses

    >Broad range of hardnesses available

    >Moldability for complex parts


    Applications:

    >Automotive electronics

    >notebook

    >power supply

    >Heat pipe thermal solutions

    >Memory Modules

    >GPS navigation and other portable devices

    >CD-Rom, DVD-Rom cooling

    >LED Power Supply

    >Rainproof LED Power

    >Waterproof LED Power

    >SMD LED module

    >LED Flesible strip, LED bar


    Typical Properties of TIF™5120-18-11US
    Color

    Grey

    VisualComposite ThicknesshermalImpedance
    @10psi
    (℃-in²/W)
    Construction &
    Compostion
    Ceramic filled silicone rubber***10mils / 0.254 mm0.21
    20mils / 0.508 mm0.27
    Specific Gravity2.8 g /ccASTM D297

    30mils / 0.762 mm

    0.39

    40mils / 1.016 mm

    0.43
    Heat Capacity1 l /g-KASTM C351

    50mils / 1.270 mm

    0.50

    60mils / 1.524 mm

    0.58

    Hardness20 Shore 00ASTM 2240

    70mils / 1.778 mm

    0.65

    80mils / 2.032 mm

    0.76
    Tensile Strength

    55 ps

    ASTM D412

    90mils / 2.286 mm

    0.85

    100mils / 2.540 mm

    0.94
    Continuos Use Temp-40 to 160℃

    ***

    110mils / 2.794 mm

    1.00

    120mils / 3.048 mm

    1.07
    Dielectric Breakdown Voltage>5500 VACASTM D149

    130mils / 3.302mm

    1.16

    140mils / 3.556 mm

    1.25
    Dielectric Constant4.2 MHzASTM D150

    150mils / 3.810 mm

    1.31

    160mils / 4.064 mm

    1.38
    Volume Resistivity1.0X1012 Ohm-meterASTM D257

    170mils / 4.318 mm

    1.43

    180mils / 4.572 mm

    1.50
    Fire rating94 V0

    equivalent UL

    190mils / 4.826 mm

    1.60

    200mils / 5.080 mm

    1.72
    Thermal conductivity1.8 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

    Thickness

    3.0mmT***

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)


    Consult the factory to alternate thickness.


    Our services


    Online-service : 12 hours , Inquiry reply within fastest.


    Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

    Well-trained & experienced staff are to answer all your inquiries in English of course.

    Standard Export Carton Or Marked With Customer's Information Or Customized.

    Provide free samples


    After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

    we will help you to deal with it and give you satisfactory solution.

    Quality 1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules for sale
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