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Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

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Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

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Brand Name :	ZIITEK
Model Number :	TIF7140Z thermal pad
Certification :	UL
Price :	negotiation
Supply Ability :	100000pcs/day
Delivery Time :	3-5 work days

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Product Details
Company Profile

Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

The TIF7140Z use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF700Z-Series-Datasheet(E)-REV01.pdf

Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling 0

Features

> Good thermal conductive: 7.0 W/mK

> Thickness: 3.5mmT

> hardness:55 shore 00

> Colour: Grey

> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance

Applications

> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

Typical Properties of TIF7140Z Series
Color	Grey	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.45 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	3.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	55 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Thermal conductivity	7.0W/mk	ASTMD5470	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 200℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.5MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	5.2X10¹³ Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	7.0 W/m-K	GB-T32064	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling 1

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

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