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Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling

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Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling

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Brand Name :	ZIITEK
Model Number :	TIF7100Z thermal pad
Certification :	UL
Price :	negotiation
Supply Ability :	100000pcs/day
Delivery Time :	3-5 work days

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Product Details
Company Profile

Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling

Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling

The TIF7100Z is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF700Z-Series-Datasheet(E)-REV01.pdf

Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling 0

Features

> Good thermal conductive: 7.0 W/mK

> Thickness: 2.5mmT

> hardness:55 shore 00

> Colour: Grey

< Naturally tacky needing no further adhesive coating
< Available in varies thicknesses
< Broad range of hardnesses available

Applications

> Cooling components to the Chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions

Typical Properties of TIF7100Z Series
Color	Grey	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.45 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	2.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	55 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Thermal conductivity	7.0W/mk	ASTMD5470	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 200℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.5MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	5.2X10¹³ Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	7.0 W/m-K	GB-T32064	Visua l/ ASTM D751	ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling 1

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Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

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