2.0mmT silicone pads Hardness 20 Shore 00 RoHS compliant for IT
infrastructure
The TIF180-01US is not only designed to take advantage of the gap heat transfer, to
fill gaps, complete the heat transfer between heating and cooling
parts, but also played insulation, damping, sealing and so on, to
meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
TIF100-01US-Series-Datasheet.pdf
Features
> Good thermal conductive: 1.5 W/mK
>Thickness: 2.0mmT
>hardness:20 shore 00
>Colour: Black
>Naturally tacky needing no further adhesive coating
>Available in varies thicknesses
>Broad range of hardnesses available
Applications
>Automotive electronics
>Set top boxes
>Audio and video components
>IT infrastructure
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
Typical Properties of TIF180-01US Series |
Color | black | Visual | Composite Thickness | Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 |
Specific gravity | 1.9 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 |
| Thickness | 2.0mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 |
Hardness | 20 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 |
| Outgasing (TML) | 0.35% | ASTM E595 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 |
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 |
Dielectric Constant | 2.9 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 |
Volume Resistivity | 1.0X1012
Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 |
Fire rating | 94 V0 | equivalent
UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 |
Thermal conductivity | 1.5 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just
contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
