Gray Thermal Gap Filler 13.0 W/m-K Thermal Conductive Pad For Automotive Engine Control Units

Products description

The TIF800QE Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features

> Good thermal conductive: 13.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Product Specifications
Standard Thickness: 0.02 to 0.20 (0.50 to 5.0mm) with increments of 0.01 (0.25mm).
Standard Size: 16" X 16" (406mm X 406mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options:NS1 (Non-adhesive treatment),DC1(Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes:FG(Fiberglas)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.5mm).
TheTIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.