Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For
AI Servers, GPU Cooling, Inverter
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
The TIF®100-32-05U Series is an ultra soft thermal interface material designed specifically
to protect precision components that are extremely sensitive to
mechanical stress. This product combines high thermal conductivity
with extreme gel grade flexibility to achieve a perfect fit with
low stress.It is suitable for solving problems such as large
tolerances,uneven surfaces, and susceptibility of precision
components to mechanical damage in high-precision assembly.
Features:
> High thermal conductivity: 3.2W/mK
> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface
adhesives
> Good insulation performance
Applications
> AI Servers, Inverters, Telecom Devices
> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
| Typical Properties of TIF®100-32-05U Series |
| Property | Value | Test method |
| Color | Blue | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density(g/cm³) | 3.0 | ASTM D792 |
| Thickness Range(inch/mm) | 0.010~0.020 (0.25~0.50) | 0.030~0.200 (0.75~5.0) | ASTM D374 |
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 3.5 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 3.2 W/m-K | ASTM D5470 |
3.2 W/m-K | ISO22007 |
Product Specifications
Standard Thickness: 0.010"(0.25 mm)-0.20" (5.00 mm) with increments
of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and
message to us.
This message should include any questions you might have about the
products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the
process and send your message to us.
4. We will reply you as soon as possible with Email or online.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat
dissipation. Please tell us your detailed applications and the
power, so we can recommend most suitable thermal conductive
materials.
