Silicone Thermal Pad With Thermal Conductivity 1.2W/M.K Work For
Computer Laptop Desktop CPU Cooling
Product description
TIF100-66U Series is a silicone based, thermally conductive gap pad. Its
unreinforced construction allows additional compliancy. This
product has low hardness is conformable and is electrically
isolating. The low modulus characteristic of the product offers
optimal thermal performance with the ease of handling.
Features
> Excellent thermal conductivity: 1.2W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Easy release construction
> Electrically isolating
> High durability
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
> Telecommunication hardware
> Handheld portable electronics
> Power supply
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
| Typical Properties of TIF100-66U Series |
| Property | Value | Test method |
| Color | Green | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | ***** |
| Thickness range | 0.010"(0.25mm)~0.200"(5.0mm) | ASTM D374 |
| Specific Gravity | 2.1 g/cc | ASTM D297 |
| Hardness | 27±5 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 160℃ | ***** |
| Dielectric Breakdown Voltage(T-1.0mm) | >5500 VAC | ASTM D149 |
| Dielectric Constant @ 1MHz | 4.0 | ASTM D150 |
| Volume Resistivity | 1.0x1012 Ohm-meter | ASTM D257 |
| Flame rating | 94-V0 | UL E331100 |
| Thermal conductivity | 1.2 W/m-K | ASTM D5470 |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied.
Please contact us for confirming.
Safe disposal method does not require special protection.The
storage condition is low temperature and dry,
away from open fire and away from direct sunlight. For detailed
method, please refer to the product material safety data sheet.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
