High-performance heat-conductive acrylic adhesive heat-conductive
double-sided adhesive
The TIA™800ALSeries products are mostly used for bonding heat dissipation fins,
microprocessors and other power consumption semiconductors. This
type of adhesive tape possesses ultimate bonding strength with low
thermal impedance, with which in effect can be able to replace the
method of lubricating grease and mechanical fixing.
Features
● Thermal Conductivity 1.6W/mK.
● High bond strength to a variety of surfaces
● Double sided pressure sensitive adhesive tape.
● High performance, thermally conductive acrylic adhesive
● allow for good conformability to irregular surfaces and good
electrical isolation
● Easy Application
● Eliminates need for external hardware (screws, clips, etc.)
● Available with easy release tabs
Applications
● LED Power Supply
● LED Controller
● LED Lights
● LED Ceilinglamp
● Monitoring the Power Box
● AD-DC Power Adapters
● Piranha wroof and common lED module
● LED module for Channelletters
● SMD LED module
● LED Flesible strip, LED bar
● LED PanelLight
| Typical Properties of TIA™800AL Series |
| Typical Properties | TIA 806AL | TIA 808AL | TIA 810AL | Test Method |
| Color | White | Visual |
| Adhesive Type | Acrylic Adhesive | ****** |
| Backing Type | Aluminum Foil | ****** |
| Continuous Use Temp | -45℃ to 120 ℃ | ****** |
| Thickness | 0.006" / 0.152mm | 0.008" / 0.203mm | 0.010" / 0.254mm | ASTM D374 |
| Voltage Breakdown | > 1000 Vac | > 1200 Vac | > 1500 Vac | ASTM D149 |
| 180° Peel Adhesion | > 1200 g/inch(Steel Immediate) | PSTC-1 |
| 180° Peel Adhesion | > 1400 g/inch(Steel after 24 hrs) | PSTC-1 |
| Holding Power 25℃/Hours | > 48 Hours | PSTC-7 |
| Holding Power 80℃/Hours | > 48 Hours | PSTC-7 |
| Thermal Conductivity | 1.6 W/mK | ASTM D5470 |
Standard Thicknesses:
0.006"(0.152mm) , 0.008"(0.203mm), 0.010"(0.254mm),
Consult the factory alternate thickness.
Standard Sizes:
16" x 100"(406mm x 30.48mm)
Individual die cut shapes can be supplied.
Company Profile
Dongguan Zhaoke Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
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