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Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules from wholesalers
     
    Buy cheap Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules from wholesalers
    • Buy cheap Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules from wholesalers
    • Buy cheap Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules from wholesalers

    Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF100C 10075-11
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules

    Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules


    TIF®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


    Features:

    > Excellent thermal conductivity 10.0W/mK

    > Self-adhesive without the need foradditional surface adhesive
    > Highly compressible, soft, and elasticAvailable in various thicknesses
    > Good chemical stability


    Applications:

    > Cooling components to the chassis of frame
    > CPU and GPU processors and other chipsets
    > High-performance computing (HPC)

    > Industrial equipment
    > Network communication devices

    > New energy vehicles

    Typical Properties of TIF®100C 10075-11 Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.3g/ccASTM D297
    thickness0.020"(0.50mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)75 (Shore 00)ASTM 2240
    Continuos Use Temp-40 to 200℃******
    Dielectric Breakdown Voltage>5500 VACASTM D149
    Dielectric Constant5.5MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity10.0W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Product Specification
    Product Thicknesses: 0.020"(0.50mm)-0.200"(5.00mm)
    Product Sizes:8" x 16"(203mm x406mm)
    Custom die-cut shapes and thicknesses are available.Please contact us for details.
    Store in a cool, dry place, away from fire and sunlight.
    Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules
    Packaging Details & Lead time

    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile

    Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


    Our services


    Online-service : 12 hours , Inquiry reply within fastest.


    Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

    Well-trained & experienced staff are to answer all your inquiries in English of course.

    Standard Export Carton Or Marked With Customer's Information Or Customized.

    Provide free samples


    After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

    we will help you to deal with it and give you satisfactory solution.

    Quality Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules for sale
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